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MP Series Multilayer Press

DCT MP series high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs according to industry standards. This was designed for high precision, varieties of multi-layer PCB. MP multilayer press is also suit for high frequency substrate with high pressure temperature, LCP and other materials, also suitable for thermoplastic, thermosetting materials such as welding resistance film, graphite, etc. it is a perfect solution for single or small batch production in the laboratory.


Features

wide adaptability and high flexibility

High temperature, high pressure, wide adaptability

High adjustable system

Precise temperature control, stable pressure, high sensitivity and adjustable system

Efficient and easy to use

Fast heating, good insulation, compact, efficient and easy to use

Precise time matching

Accurately match Temperature, pressure and time, essential equipment for multilayer PCBs

High performance and quality

High performance and quality with reasonable price, first choice for thermal press processing

Product parameters

Technical data

MP300

MP300D

Max. wiring area

285mm x 205mm

305mm x 230mm

Borad size

305mm x 230mm

355mm x 280mm

Pressure

300N/cm2  

300N/cm2  

Max. Temperature

250℃

250℃

Max. layer at one time

2

6

Max. layer

8

8

Pressing time

Approx.90min.

Approx.90min.

Automatic hydraulic device

Standard

Standard

Suitable substrate materials

FR4、PTFE、LCP、Graphite etc.

FR4、PTFE、LCP、Graphite etc.

 

Technical data

MP300

MP300D

Power requirement

220V/50Hz, 2.1kW

220V/50Hz, 3kW

Dimension (W x H x D)

550 x 550 x 700mm

600 x 600 x 1,330mm

Weight

180kg**

450kg**