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半導體A 450.jpg
Silicon nitride precise cutting
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Silicon wafer drilling, cutting and blind slot making
半導體C 730.jpg
Silicon carbide precise cutting

Semiconductor material precise cutting

DCT DirectLaser S or U series are ideal for cutting Silicon carbide (SiC), Silicon nitride (AlSiC), Aluminum silicon carbide (AlSiC), Gallium arsenide (GaAs) etc. They also can be used for making MEMS micro structure.